Electronic Packaging: Materials and Their Properties - Buffalo ChapterNot a MyNAP member yet? Register for a free account to start saving and receiving special member only perks. Below is the uncorrected machine-read text of this chapter, intended to provide our own search engines and external engines with highly rich, chapter-representative searchable text of each book. Adequate packaging has to be provided to build functional modules based on these devices, however. The primary issues to be considered in high-temperature electronic packaging are: 1 characterizing materials and their interactions at high temperatures, 2 minimizing mechanical stresses caused by thermal expansion mismatches, 3 providing a suitable path for heat dissipation, and 4 providing environmental protection.
Paper and paper based packaging materials
Electronic Packaging Materials and Their Properties
Advanced substrates for flip chip must also provide increased wireability while delivering improved electrical performance with reliability levels at least equivalent to current surface mount applications. Polyimide glass x - y plane. Since some large hybrid microcircuits and multichip elecgronic closely resemble both first- and second-level packaging and because the high-temperature electronic boards are often ceramic with thick- or thin-film metallization, they share the same materials and assembly processes and are considered here to be the same high- temperature electronic-packaging technology Palmer and Heckm. Not a MyNAP member yet?
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Chapter Officers. Technical Support. ASM Staff Directory. Patrick McCluskey, Terrance J. Packaging materials strongly effect the effectiveness of an electronic packaging system regarding reliability, design, and cost.
The use of existing high-density multichip module designs can leverage the development of high-temperature electronic systems by careful selection of the material systems used. By IR. In the recent years, therefore CuSiC is hardly in commercial stage yet and extensive study should be carried out on CuSiC as a best candidate for thermal management materials. Evaporation is expensive because the masks must be regularly cleaned and there properrties excessive scrap solder. Michaelides and S.
McCluskey Ed. The elemental constituents of Pb-free solders Sn, do not radioactively decompose so alpha particle radiation. These are addressed by plasma or ultraviolet UV -ozone cleaning of the surface prior to wirebond. Some research works related to hygrothermal test can be seen in the references.
Danielson, R. Reflow would form the solder joints and cure the underfill simultaneously. Enter the email address you signed up with and we'll email you a reset link. New materials are the area where the most significant improvements in thermal performance are possible.